ZutaCore, which makes waterless two-phase liquid cooling systems for AI and high-performance computing infrastructure, has closed a $100 million Series C round backed by Mitsubishi Electric, Carrier Ventures, and Samsung Ventures.
The funding will support global commercialisation and R&D into thermal management for next-generation chip architectures, with ZutaCore’s platform already designed to handle processors exceeding 4,000 watts. The company has completed more than 75 deployments across the Americas, Europe, and Asia.
Chairman and CEO Erez Freibach said AI is fundamentally reshaping data centre infrastructure in ways that traditional cooling approaches can no longer support. To match accelerating demand, the company has expanded its executive team with four senior hires spanning finance, operations, R&D, and people strategy — including Yaniv Reinhold as CFO and Sharon Shafran as COO.
ZutaCore has also established a two-megawatt emulation platform in Israel to validate deployments at scale before production, reducing risk for hyperscalers and data centre operators.
