Hyperlume Announces $12.5M Funding Round to Transform AI Data Center Connectivity
By James Dargan · · 2 min read
Hyperlume, a pioneer in next-generation data center interconnection technology, has raised $12.5 million USD ($17.8 million CAD) in seed funding to commercialize its microLED-based connectivity solutions. The round was led by BDC’s Deep Tech Venture Fund and ArcTern Ventures, with participation from MUUS Climate Partners, SOSV, and Intel Capital, alongside a strategic investment from LG Technology Ventures.
Founded in 2022 by CEO Mohsen Asad and President and CTO Hossein Fariborzi, Hyperlume is addressing connectivity bottlenecks in accelerated computing and AI data centers with its specialized microLED technology. The company claims its interconnects deliver ten times the computing performance, five times the power savings, and four times lower cost compared to traditional copper interconnects.
“As the demand for AI grows, so do its energy requirements, placing a significant burden on traditional copper interconnects,” said Srini Ananth, Managing Director at Intel Capital. “Hyperlume’s technology effectively tackles bottlenecks hindering optimal performance in AI and data centers, representing a major advancement for the semiconductor industry.”
A report from Goldman Sachs projects a 160 percent increase in data center power demand by 2030, potentially doubling carbon emissions. This underscores the urgent need for energy-efficient solutions like Hyperlume’s, said Murray McCaig, Managing Partner at ArcTern Ventures.
Hyperlume will use the funding to accelerate development, expand its product and engineering teams, and strengthen partnerships with cloud service providers, chip manufacturers, and AI infrastructure leaders. With AI adoption driving exponential data center growth, Hyperlume’s innovation promises to reshape connectivity and energy efficiency in the AI era.
