Insider Brief
- EdgeCortix closed an oversubscribed Series B round, bringing total funding to over $110 million, complemented by a new ¥1.5 billion credit facility to accelerate R&D and scale production of its energy-efficient edge AI hardware and software platforms.
- The financing underscores strong global confidence in its low-power AI inference technology, supported by investors including TDK Ventures, CCBI, Jane Street, and others, along with continued backing from previous stakeholders.
- Together with a ¥3 billion NEDO-backed project, the company is advancing its SAKURA-II and next-generation SAKURA-X chiplet platforms to deliver high-performance, low-power AI across robotics, telecoms, aerospace, defense, and industrial automation.
PRESS RELEASE — EdgeCortix® Inc., a leading fabless semiconductor company pioneering energy-efficient artificial intelligence (AI) processing at the edge, announced the second close of its oversubscribed Series B financing round, raising total funding to more than US$110 million.
The Series B closed more than 30% oversubscribed, signaling strong global investor confidence in EdgeCortix’s power-efficient AI processing technology, execution track record, and market momentum. New investors include TDK Ventures, CDIB Cross Border Innovation Fund II LP (CCBI), Jane Street Global Trading, joining previously announced investors from the first close, Yanmar Ventures, Pacific Bays Capital, NTT Finance Corporation, SiC Power, and Aero X Ventures, with continued participation from existing investors SBI Investment and Global Hands-On VC (GHOVC). Pacific Bays Capital made additional investments in this Series B second close.
Amid sustained investor interest, the company is considering a supplementary raise later this year to accommodate additional strategic and financial investors.
In parallel to the equity financing, Mizuho Bank, Ltd. has extended a ¥1.5 billion (≈US$10 million) unsecured credit facility, strengthening EdgeCortix’s balance sheet and deepening its long-term banking relationship. In combination, the Series B proceeds and credit facility will support R&D acceleration, global go-to-market expansion, and mass-production scale-up of EdgeCortix’s flagship hardware and software platforms.
Earlier this year, the company also secured a ¥3 billion (≈US$20 million) government-backed project from Japan’s New Energy and Industrial Technology Development Organization (NEDO) to develop a next-generation low-power AI inference and learning chiplet platform, further validating EdgeCortix’s leadership in sustainable semiconductor innovation.
“The strong response to our Series B round from both existing and new investors reflects growing recognition of EdgeCortix as a global leader in energy-efficient AI processing,” said Dr. Sakyasingha Dasgupta, Founder and CEO of EdgeCortix. “With this capital along with continued government and alternative financing, we are ramping up the production and sales of our SAKURA-II AI accelerator and reducing the time-to-market for our next-generation SAKURA-X chiplet platform, enabling high-performance, low-power AI inference across robotics, telecommunications, aerospace, space, defense, smart-infrastructure and industrial automation worldwide.”
“The Edge AI market now demands performance and energy efficiency in equal measure. EdgeCortix stands out with a system-level approach, co-designing hardware and software from the ground up to deliver scalable, low-power AI inference. Their ‘software-first’ architecture, an ‘OS for Edge AI,’ unites reconfigurable silicon with an intelligent compiler for maximum efficiency. This approach aligns with TDK’s broader vision for intelligent, energy-efficient technologies at the edge. TDK Ventures is proud to support EdgeCortix as they scale globally across industries such as robotics, smart infrastructure, and beyond,” said Ankur Saxena, Investment Director, TDK Ventures.
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Racepoint Global for EdgeCortix
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