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Matter Venture Partners

Veir Raises $110M in Series C Funding to Scale Superconducting Power Systems for AI Data Centers

Insider Brief Veir has raised $110 million in Series C funding to move its superconducting power-delivery technology from testing into commercial deployment for AI data centers. Its approach is designed to reduce the amount

8 Oct 2026 · 2 min read

Technology & Infrastructure · Applications & agents

TYLsemi Announces $43M to Launch First Full-Stack Chiplet Platform for Custom AI Silicon

23 Jul 2026

Business & Markets · Startups

Anvil Robotics Raises $6.5M in Funding for Composable Modules Physical AI Platform

3 Apr 2026

Business & Markets · Startups

ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design

21 Feb 2026

Business & Markets · Startups

Tacta Systems Announces $75 Million in Funding to Bring Dextrous Intelligence to Robots

1 Jul 2025

Business & Markets · Startups

Path Robotics Secures $100M of Venture Capital Funding: AI-enabled Robotic Welding Company Closes Series D Funding

15 Oct 2024

Matter Venture Partners

Veir Raises $110M in Series C Funding to Scale Superconducting Power Systems for AI Data Centers

TYLsemi Announces $43M to Launch First Full-Stack Chiplet Platform for Custom AI Silicon

Anvil Robotics Raises $6.5M in Funding for Composable Modules Physical AI Platform

ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design

Tacta Systems Announces $75 Million in Funding to Bring Dextrous Intelligence to Robots

Path Robotics Secures $100M of Venture Capital Funding: AI-enabled Robotic Welding Company Closes Series D Funding

Trending today

Anthropic Enters AI Agent Race With Claude Duet for Professionals and Small Businesses

Google Open-Sources TorchTPU to Challenge Nvidia’s Grip on AI Development

Chinese Hackers Use AI Agents to Breach Thousands of Companies via ConnectWise

Oracle Commits $1B to Partner Ecosystem to Meet Growing AI Demand

Reliable Robotics Raises Another $115M, Pushing Series D to $275M in Funding

Matter Venture Partners

Veir Raises $110M in Series C Funding to Scale Superconducting Power Systems for AI Data Centers

TYLsemi Announces $43M to Launch First Full-Stack Chiplet Platform for Custom AI Silicon

Anvil Robotics Raises $6.5M in Funding for Composable Modules Physical AI Platform

ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design

Tacta Systems Announces $75 Million in Funding to Bring Dextrous Intelligence to Robots

Path Robotics Secures $100M of Venture Capital Funding: AI-enabled Robotic Welding Company Closes Series D Funding

Trending today

Anthropic Enters AI Agent Race With Claude Duet for Professionals and Small Businesses

Google Open-Sources TorchTPU to Challenge Nvidia’s Grip on AI Development

Chinese Hackers Use AI Agents to Breach Thousands of Companies via ConnectWise

Oracle Commits $1B to Partner Ecosystem to Meet Growing AI Demand

Reliable Robotics Raises Another $115M, Pushing Series D to $275M in Funding

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