Bosch Ventures has joined a $22 million Series B extension funding round for Point2, aiming to revolutionize network interconnect technology in the automotive and datacenter sectors.
Point2’s E-Tube platform, challenging traditional copper and optical solutions, offers a lighter, more cost-effective, and energy-efficient multi-terabit interconnect solution using RF data transmission through a plastic dielectric waveguide. This innovation is particularly relevant for automotive applications, where it can support the complex networking needs of advanced driver assistance systems by connecting numerous sensors with lower power, latency, and weight.
The funding, bolstered by strategic investor Molex and existing backers, supports Point2’s ambition to cater to the increasing demands of AI and large language models in hyperscale data centers, highlighting the potential of its interconnect chips to enhance connectivity significantly.
“We are thrilled to have support from Bosch Ventures and Molex as we advance our mission to revolutionize interconnect technology in AI/ML data centers and next-generation automotive applications,” said Sean Park, Point2’s founder and CEO. “Our investment from Bosch Ventures underlines the importance and high potential of Point2’s low-power, low-latency, scalable interconnect technologies in the expansive automotive sector, and further amplifying our impact connecting AI workloads for the growing data center market.”
“Moving forward, interconnect provides critical infrastructure for high-performance and energy-efficient data centers and networked automotive applications,” said Ingo Ramesohl, Managing Director of Bosch Ventures. “Point2’s unique interconnect SoC solutions deliver the high-bandwidth interconnect required in the data center and automotive sector while reducing energy consumption and minimizing carbon footprint. The company and its technologies have a high potential to become a disruptor in network interconnect in both markets.”
