Dresden-based Semron has raised $7.9 million in seed funding to advance its mobile AI chip technology, featuring innovative 3D packaging for enhanced efficiency in consumer devices. The investment round was led by Join Capital, with contributions from SquareOne, OTB Ventures, and Onsight Ventures. Semron’s chips aim to meet the increasing demand for AI in small devices like smartphones, earbuds, and VR headsets, focusing on applications such as digital assistants, voice control, live translation, and video processing.
The company intends to use the funds for hardware and compiler development, team expansion, and to push for international growth. With currently eleven employees, Semron plans to significantly increase its workforce by the end of the year. Its 3D semiconductor technology promises up to 20x efficiency, allowing for much larger AI models without the need for bigger chips. Semron’s unique CapRAM technology, based on a ‘memcapacitor,’ distinguishes its chips from competitors like Nvidia, aiming to lead in performance and cost-efficiency for edge computing devices with advanced AI capabilities.
Comments from those involved in the funding round:
“We recognize the immense potential of Semron’s innovation to redefine the landscape of AI capabilities in smart devices globally and to start a new dynamic in the semiconductor industry that is struggling with the era of GenAI.”
— Jan Borgstädt, the managing partner at Join Capital
“Our advantage lies in our technology’s ability to run several hundred times larger AI models and to deliver up to 20 times the efficiency at a cost two orders of magnitude lower per unit of performance. This is achieved through the paradigm shift to stack many compute layers on the same silicon substrate.”
— Aron Kirschen, CEO of Semron
Featured image: Credit: Semron
